Mechanical bottom-up nano-assembling and nano-manipulation using shape memory alloy nano-gripper
Dr. Svetlana von Gratowski
Kotelnikov IRE RAS
The numerous nano-scale materials, such as nano-particles and nano-structures in particular, 1-D and 2-D nano-materials: nano-tubes, nano-wires (NWs), etc in the past decades were discovered and intensively studied. They had appeared to demonstrate the unique functional properties allowing to construct the large number of individual nano-devices based on individual nano-objects. Recently many studies have led to a broad range of proof-of-concept of individual nano-scale devices including nano-lasers, nano-sensors based on NWs and carbon nano-tubes (CNT), field-effect transistors (nano-FETs), etc. Such nano-devices represent attractive building blocks for hierarchical assembly. Hierarchical assembly of functional nano-scale/meso-scale and macroscopic devices from nano-scale building blocks based on individual nano-scale devices offers many opportunities for creating of micro- and –macro-devices and arrays by the bottom-up and hybrid paradigm. 5 steps in the bottom-up approach for production of nano-devices:
- to tailor (make) nano-materials
- to etch (clean), passivate, or dope the surface of the nano-material
- to cut nano-materials into individual components
- to fabricate elements and organize these elements or components into nano-devices
- to link (interconnect and integrate) individual nano-devices together into the micro,-meso- and -macro world.
In the presentation, proposed future application of the smallest and the fastest in the World nano-tweezer which is able to manipulate real nano-objects like nanotubes, nanowires, etc. are discussed. Such nano-manipulation can be used for nano-manufacturing of nano-devices and micro-devices by mechanical nano-manipulation and bottom up mechanical nano-assembling and nano-integration that in many cases can replaced very expensive with high running cost top-down nano-lithography.